The Complexities of AI

Accelerate AI Innovation: viaPhoton’s HyperReach™ Solution changes 
the norm by cutting data center deployment time by 83%, eliminating 
field testing and enabling faster time-to-market for your AI applications.

Accelerate Deployment Velocity

Dramatically reduce installation time resulting in producing revenue sooner.

Eliminate Field Testing

100% factory testing with bullet train ensures the highest quality and eliminates the risk of damage to components.

viaPhoton Fiber Trunk Module™ (FTM) – MMC Connector

viaPhoton Fiber Trunk Module™ (FTM) – MMC Connector

83% faster
Deploy your fiber
infrastructure 83% faster
Elimination
of Field Testing
for HyperReach™
Solution

High Density Products

Unbelievable efficiency

Reduce installation time by 90%

The density demands of AI will overwhelm already crowded conveyances — our Torpedo and Bullet Train solutions dramatically reduce the effort and complexity of installing structured cabling.

Unbeatable density

Make next-gen networks possible

Reach and exceed next-gen connectivity needs without a complete redesign: Our HyperReach™ solution supports an incredible 3,456 or 5,184 fibers in just 1U of space.

Culture of innovation

Unlock the best in 
engineered solutions

Our Data Center Interconnect sets a completely new standard for ease-of-use & install — built in conjunction with input from industry leaders and hyperscalers.​

Downloads

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HyperReach™ FTM – with Bull…

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HyperReach™ FTM – no test…

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HyperReach FTM – spec she…

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HyperClone – Breakout solut…

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Elimination of Field Testing…

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MMC Connector – Fiber Trunk…

Ready to get started?

Connect with our thought leaders and engineering experts on developing the solutions necessary to succeed.

Be the bar

viaPhoton leaders and engineers have hundreds of patents 
to their name.

Nimble Always​

No other provider can beat our pace of innovation: prototype, to test, mere weeks for scale.